The Federation of Malaysian Manufacturing (FMM) successfully coordinated the participation of 47 delegates from 27 companies at Shanghai World of Packaging (SWOP) 2025 in Shanghai, China, held from November 25 to 27, 2025, at the Shanghai New International Expo Centre (SNIEC). As a member of the Interpack Alliance, SWOP emphasises artificial intelligence, digital and sustainable packaging, processing machinery, and innovative packaging materials.
The event highlighted key trends shaping the packaging industry and facilitated structured business-matching sessions, enabling delegates to engage with relevant industry players, explore collaboration opportunities, and identify potential partners for future business development.
