Shanghai World of Packaging (SWOP), as a member of the inter-pack alliance, showcases innovations in artificial intelligence, smart and sustainable packaging, automation, processing machinery, materials, components and design. SWOP 2025 will bring together packers, brands and Original Equipment Manufacturer (OEM)/ Original Design Manufacturer (ODM) manufacturers to explore key trends such as asset-light strategies, youth-focused packaging, smart technologies and emerging design innovations, driving the packaging industry towards a smarter and greener future.